The performance of semiconductors has improved remarkably, with wiring widths narrowing by approximately 1/10,000 since their introduction in the 1960s. The area that once held a single transistor now contains more than 10,000 transistors, and semiconductors that once only had a few layers are now stacked in hundreds, like a skyscraper. The width of the wiring that makes up semiconductors is now exceeding the nm (nanometer) unit and is on the verge of reaching the Å (angstrom) level.
To further advance this ever-advancing evolution, we will continue to pursue cutting-edge development. To integrate semiconductors accurately and in large quantities, it is necessary to carry out reactions in an environment that is almost free of impurities and to polish the wafer surface to an extremely flat surface. For this purpose, our products such as "dry vacuum pumps" and "CMP equipment" are used.