EBARA Corporation on Wednesday, January 22-24, 2025 3 days at Tokyo Big Sight Nepcon Japan's 26th Semiconductor Sensor Packaging Exhibitionopens in a new tab (hereinafter : This exhibition)
This exhibition is a specialized exhibition specializing in the semiconductor post-process where technological innovations such as 2.5D/3D, chippet, heterogeneous, etc.
Panels exhibit large panel-level packaging CMP equipment and plating equipment, including electroplating equipment for advanced packaging applications. We will also exhibit a full-size, compact, vacuum-cooled dry vacuum pump model:
Participated in the 26th Semiconductor Sensor Packaging Exhibition at Nepcon Japan
Exhibit Overview
Exhibition Name:Nepcon Japan's 26th Semiconductor Sensor Packaging Exhibition
Session: January 22, 2025 Wednesday 10:00-17:00
Venue:Tokyo Big Sight East 7 Hall booth number: E65-31 (pre-registration:hereopens in a new tab)
Organized: RX Japan Corporation
Major exhibition:
- Electrolytic plating equipment:ZP300A
- Panel-level packaging CMP equipment/plating equipment: EAPI/UFP type
- CMP equipment: F-REX300XA
- Small air-cooled dry vacuum pump: EV-A10 type
The EBARA Group aims to achieve sustainable development goals (SDGs) by addressing ESG important issues based on its long-term vision and medium-term management.
※The indication of "○○○ type" in the sentence is our model code.
For inquiries about this matter : pmc_info@ebara.com
Contact us : ec-pr@ebara.com