EBARA Corporation (hereinafter referred to as EBARA) will begin sales of the LPCMN-type combustion-type exhaust gas abatement systems, which detoxifies process gas in semiconductor manufacturing, in January 2025.
1. Background
The semiconductor manufacturing process uses a variety of new special material gases. In addition to safely detoxifying them, it is also required to reduce the generation of reactive by-products generated in the process, extend the continuous operating time of the exhaust gas abatement systems, and prevent the production line from being shut down.
To meet these needs, EBARA has developed a new LPCMN exhaust gas abatement systems with improved processing performance and durability than the conventional TND system.
2. Features
This product has the following four main features.
① Suppression of by-product adhesion and NOx/COx Compatibility of emission reduction
Achieved DRE value of 95% or higher for persistent gas such as CF4, which is equivalent to or higher than that of conventional products. The newly developed two-stage combustion burner minimizes by-product adhesion in the gas treatment reaction section and reduces NOx/COx emissions.
② Miniaturization of the product saves space
The size of the chassis has been reduced by approximately 50% compared to the conventional model. By miniaturizing the product, it is possible to effectively utilize the upper space created.
③ Hydrogen Fuel Specification Lineup
Hydrogen Fuel in addition to fossil fuels has been added to the lineup.
④ Maximum air volume 600L/min
It is a compact design, but it has the same maximum air volume as the conventional TND type. 3. Specifications