Announcement of new plating equipment UFP600AS type

Ebara Corporation (hereinafter referred to as "Ebara") Precision Machinery Company has announced the launch of the new UFP600AS model, a new type of plating equipment for semiconductor mounting, which is the company's flagship product.
This equipment enables plating of large rectangular boards, and combines the high plating performance achieved by our previous plating equipment, the UFP series, with improved productivity through the squaring and expansion of board area.

Our existing equipment, the UFP300A model, has been adopted by leading semiconductor manufacturers for Fan-out WLP technology, which has rapidly spread in recent years as the next generation semiconductor mounting technology. Demand for higher performance and higher density in semiconductor mounting is on the rise, and in order to further improve productivity, Fan-out type PLP technology using large rectangular substrates has attracted attention.
Ebara has developed a new fixture mechanism for this new equipment that can handle the transportation and plating of large rectangular substrates. By using this fixture mechanism, it is possible to inherit the vertical plating cell structure and advanced mixing function technologies that have achieved the industry's highest level of process performance with existing equipment, making it possible to achieve high process performance and productivity with large square substrates.
We are confident that this new equipment will meet the advanced needs of customers for cutting-edge semiconductor mounting technology.

Ebara will introduce the new equipment UFP600AS type in a poster exhibited at Semicon Japan 2017, which is being held at Tokyo Big Sight from today.

(The plating equipment uses electrolytic plating to create metal material films required for wiring for signal communication and power supply of semiconductor chips in units of micrometers (1 micro is 1/1000 of a millimeter).)

※ "The 'XXX type' designation is our model code."