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Today, in order to achieve greater performance in semiconductor, they have to be multilayer-structured to accommodate more transistors and wires. It looks like a high-rise building in sub-micron scale!
Ebara's leading-edge CMP provides an advanced planarization capability that is necessary to enable reliable multilayer-structure for advanced semiconductors.
(CMP stands for Chemical Mechanical Polishing.)
Semiconductor Packaging is an another area that requires advancements moving forward to enable better performance in overall semiconductor device.
EBARA's Model UFP provides superior electric plating capability that enables advanced packaging scheme like bumping, re-distribution wiring and TSV (Through Silicon Via.)
Obtaining high yield is one of the most important goal of semiconductor manufacturing. This means never-ending fight with defects in manufacturing line.
EBARA provides its unique polishing technology as a solution for wafer bevel treatment that has been highlighted as a very critical area for defect control.
(Bevel is a edge portion of wafer substrate that is used for semiconductor manufacturing.)
Electron Beam Inspection System
Semiconductor manufacturing technology is required to detect even finer defectivity in manufacturing processes.
EBARA takes e-beam technology to the next level and provides solution to such super-fine defect detection capability where optical technology can not achieve.